汉高电子材料市场汉高电子材料市场汉高电子材料市场汉高电子材料市场汉高电子材料市场汉高电子材料市场汉高电子材料市场

FEATURES AND BENEFITS ● Thermal Conductivity: 1.0 W/m-K ● Highly Conformable, low hardness ● “Gel-like” modulus ● Fiberglass reinforced for puncture, shear and tear resistance BERGQUIST GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material. TYPICAL APPLICATIONS ● Computer and peripherals ● Telecommunications ● Heat interfaces to frames, chassis or other heat spreading devices ● RDRAM™ memory modules / chip scale packages ● CDROM / DVD cooling ● Areas where irregular surfaces need to make a thermal interface to a heat sink ● DDR SDRAM memory modules ● FBDIMM modules TYPICAL PROPERTIES OF CURED MATERIAL Young's modulus is calculated using 0.01 in/min, step rate of strain with a sample size 0.79 inch2. Physical Properties Hardness, Shore 00 , Thirty second delay value , ASTM D2240, Bulk rubber 25 Heat Capacity, ASTM E1269, J/g-K 1.0 Density, Bulk rubber, ASTM D792, g/cc 1.6 Flammability, UL 94 V-0 Young's Modulus, ASTM D575 kPa 275 (psi) (40) Electrical Properties Dielectric Breakdown Voltage , ASTM D149, VAC >5,000 Dielectric Constant, ASTM D150, 1,000Hz 5.5 Volume Resistivity, ASTM D257, ohm-meter 1×1011 Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 1.0 Thermal Impedance, 0.020 inch ASTM D5470, oC-in2 /W: 10% Deflection 1.3 20% Deflection 1.0 30% Deflection 0.96 The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. GENERAL INFORMATION For safe handling information on this product, consult the Safety Data Sheet, (SDS). Not for product specifications The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specificatio