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PRODUCT DESCRIPTION LOCTITE ECCOBOND FP4451 provides the following product characteristics: Technology Epoxy Appearance Black Product Benefits ● High purity ● Minimal slumping ● Green product Filler Weight, % 72 Cure Heat cure Application Encapsulant - dam Operating Temperature -65 to 150 °C Typical Package Application BGA and IC memory cards Flammability Rating UL 94 HB @ 25 mm thickness LOCTITE ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. TYPICAL PROPERTIES OF UNCURED MATERIAL Viscosity, Brookfield - RVT, 25 °C, cps: Spindle 7, speed 2 rpm 1,300,000 Spindle 7, speed 4 rpm 860,000 Specific Gravity @ 25 °C 1.76 Gel Time @ 121oC, minutes 8 Pot Life @ 25 °C (time to double viscosity), days 2 Shelf Life @ -40°C (from date of manufacture), months 9 Flash Point - See SDS TYPICAL CURING PERFORMANCE Recommended Cure Schedule 30 minutes @ 125°C plus 90 minutes @ 165°C Alternate Cure Schedule 1 hour @ 165°C This material can be co-cured after encapsulation. The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures. TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties Coefficient of Thermal Expansion , ppm/°C: Below Tg (40 to 120°C) 22 Glass Transition Temperature (Tg) by TMA, °C 155 Extractable Ionic Content, ppm: Chloride (Cl-) 10 Sodium (Na+) 4 Potassium (K+) 1 GENERAL INFORMATION For safe handling information on this product, consult the Safety Data Sheet, (SDS). Not for product specifications The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product. THAWING: 1. Allow container to reach room temperature before use. 2. DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. 3. DO NOT re-freeze. Once thawed, the adhesive should not be re-frozen. STORAGE: Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.