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PRODUCT DESCRIPTION LOCTITE EDAG PF 021 E&C provides the following product characteristics: Technology Thermoplastic Appearance clear Operating TemperatureMaximum 204oC Product Benefits ? Fast UV cure ? Prevents silver migration ? Physically protects SMD ? Process ease ? Dot dispensable Cure Ultraviolet (UV) light Application Encapsulant Key Substrates Polyester, Polycarbonate film and FR-4 LOCTITE EDAG PF 021 E&C encapsulating photopolymer is designed to secure low profile surface mount devices (SMD) to rigid or flexible substrates. It is particularly effective for use as a physical and environmental protection of the mounted device. TYPICAL PROPERTIES OF UNCURED MATERIAL Solids Content by Weight, % 100 Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm 11,500 Theoretical coverage, sq ft/gal: @ 10 μm coating thickness 1,600 Shelf Life @32°C, year (from date of qualification in original seal) 1 Flash Point - See SDS TYPICAL CURING PERFORMANCE Recommended UV Cure Light Dose, Joule/cm2 0.4 to 1.0 For thicknesses >2.0 mils, a longer wavelength bulb is required e.g. Fusion "D". UV measurements were made with an EIT radiometer. Percent Volatiles VOC, g/l 0 The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures. TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties Hardness, Shore A 80 Pencil hardness 2B Elongation, % 176 Electrical Properties Dielectric Constant , ASTM D150-87 3.24 Dielectric Strength , ASTM D149-91, volts 750 TYPICAL PERFORMANCE OF CURED MATERIAL Tensile Strength N/mm2 7.58 (psi) (1,100) GENERAL INFORMATION For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). DIRECTIONS FOR USE 1. Mixing/Dilution ● Product is ready for use but should be mixed thoroughly using a plastic spatula. (Syringe-packed material needs no mixing). ● Mix smoothly from bottom of container , being careful not to whip air into the product. 2. Application ● LOCTITE EDAG PF 021 E&C should be applied in a glob over the entire surface if small devices, or along the outside leads of large devices. ● Its viscosity is designed to conform to the device and flow out over the substrate just prior to UV curing. ● Dot dispensing equipment should be selected based on the exact application, i.e., device size and production speed. 3. Cleanup ● Uncured resin may be cleaned with Isopropanol, cellosolve acetate and similar solvents.